JPH0723864Y2 - 温度ヒューズ - Google Patents
温度ヒューズInfo
- Publication number
- JPH0723864Y2 JPH0723864Y2 JP1954688U JP1954688U JPH0723864Y2 JP H0723864 Y2 JPH0723864 Y2 JP H0723864Y2 JP 1954688 U JP1954688 U JP 1954688U JP 1954688 U JP1954688 U JP 1954688U JP H0723864 Y2 JPH0723864 Y2 JP H0723864Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- thermal fuse
- point metal
- metal body
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 18
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 16
- 230000008018 melting Effects 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000012212 insulator Substances 0.000 description 20
- 238000009413 insulation Methods 0.000 description 7
- 206010057040 Temperature intolerance Diseases 0.000 description 4
- 230000008543 heat sensitivity Effects 0.000 description 4
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Thermally Actuated Switches (AREA)
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1954688U JPH0723864Y2 (ja) | 1988-02-16 | 1988-02-16 | 温度ヒューズ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1954688U JPH0723864Y2 (ja) | 1988-02-16 | 1988-02-16 | 温度ヒューズ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01124637U JPH01124637U (en]) | 1989-08-24 |
| JPH0723864Y2 true JPH0723864Y2 (ja) | 1995-05-31 |
Family
ID=31235153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1954688U Expired - Lifetime JPH0723864Y2 (ja) | 1988-02-16 | 1988-02-16 | 温度ヒューズ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723864Y2 (en]) |
-
1988
- 1988-02-16 JP JP1954688U patent/JPH0723864Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01124637U (en]) | 1989-08-24 |
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